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 MC14013B Dual Type D Flip-Flop
The MC14013B dual type D flip-flop is constructed with MOS P-channel and N-channel enhancement mode devices in a single monolithic structure. Each flip-flop has independent Data, (D), Direct Set, (S), Direct Reset, (R), and Clock (C) inputs and complementary outputs (Q and Q). These devices may be used as shift register elements or as type T flip-flops for counter and toggle applications.
Features
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14 PDIP-14 P SUFFIX CASE 646 1 14 SOIC-14 D SUFFIX CASE 751A 1 14 TSSOP-14 DT SUFFIX CASE 948G 1 14 SOEIAJ-14 F SUFFIX CASE 965 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb-Free Package (Note: Microdot may be in either location) MC14013B ALYWG 14 013B ALYW G G 14013BG AWLYWW MC14013BCP AWLYYWWG
* * * * * * * *
Static Operation Diode Protection on All Inputs Supply Voltage Range = 3.0 Vdc to 18 Vdc Logic Edge-Clocked Flip-Flop Design Logic state is retained indefinitely with clock level either high or low; information is transferred to the output only on the positive-going edge of the clock pulse Capable of Driving Two Low-power TTL Loads or One Low-power Schottky TTL Load Over the Rated Temperature Range Pin-for-Pin Replacement for CD4013B Pb-Free Packages are Available
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol VDD Vin, Vout Iin, Iout PD TA Tstg TL Parameter DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) Input or Output Current (DC or Transient) per Pin Power Dissipation, per Package (Note 1) Ambient Temperature Range Storage Temperature Range Lead Temperature (8-Second Soldering) Value -0.5 to +18.0 -0.5 to VDD + 0.5 10 500 -55 to +125 -65 to +150 260 Unit V V mA mW C C C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Temperature Derating: Plastic "P and D/DW" Packages: - 7.0 mW/_C From 65_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS v (Vin or Vout) v VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2006
October, 2006 - Rev. 7
1
Publication Order Number: MC14013B/D
MC14013B
TRUTH TABLE
Inputs Clock Data 0 1 X X X X X X X Reset 0 0 0 1 0 1 Set 0 0 0 0 1 1 Outputs Q 0 1 Q 0 1 1 Q 1 0 Q 1 0 1 No Change
X = Don't Care = Level Change
PIN ASSIGNMENT
QA QA CA RA DA SA VSS 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD QB QB CB RB DB SB 3 4 8 9 6 5
BLOCK DIAGRAM
D
S
Q
1
C
R
Q
2
D
S
Q
13
11 10
C
R
Q
12 VDD = PIN 14 VSS = PIN 7
ORDERING INFORMATION
Device MC14013BCP MC14013BCPG MC14013BD MC14013BDG MC14013BDR2 MC14013BDR2G MC14013BDTR2 MC14013BDTR2G MC14013BF MC14013BFG MC14013BFEL MC14013BFELG Package PDIP-14 PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* SOEIAJ-14 SOEIAJ-14 (Pb-Free) SOEIAJ-14 SOEIAJ-14 (Pb-Free) 2000 Units / Tape & Reel 50 Units / Rail 2500 Units / Tape & Reel 55 Units / Rail 25 Units / Rail Shipping
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free.
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2
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I II II I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII II III I I I I I I I I I I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIII I I IIII I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII III II IIII I III II IIII II III II IIII I I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I II III I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIII I III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIII IIIIIIIIIIIIIIIIIIIIIIII I IIIIII I I I I I I III II IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII II I IIII II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I I II IIII III I I I I I I I I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII IIIII III IIIII I I II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIII I I I I I I III II III II I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Total Supply Current (3) (4) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) Quiescent Current (Per Package) Input Capacitance (Vin = 0) Input Current Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) Input Voltage "0" Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) Output Voltage Vin = VDD or 0 (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) (VO = 0.5 or 4.5 Vdc) "1" Level (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Vin = 0 or VDD Characteristic "0" Level "1" Level Source Sink Symbol VOH VOL IOH VIH IDD IOL Cin VIL Iin IT VDD Vdc 5.0 10 15 5.0 10 15 5.0 10 15 5.0 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 15 - - 3.0 - 0.64 - 1.6 - 4.2 4.95 9.95 14.95 0.64 1.6 4.2 Min 3.5 7.0 11
2. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. 3. The formulas given are for the typical characteristics only at 25_C. 4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL - 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD - VSS) in volts, f in kHz is input frequency, and k = 0.002.
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MC14013B
- - -
-
-
- - -
- - -
- 55_C
3 0.1 0.05 0.05 0.05 Max 1.0 2.0 4.0 1.5 3.0 4.0 - - - - - - - - - - - - - - - 2.4 - 0.51 - 1.3 - 3.4 4.95 9.95 14.95 0.51 1.3 3.4 Min IT = (0.75 mA/kHz) f + IDD IT = (1.5 mA/kHz) f + IDD IT = (2.3 mA/kHz) f + IDD 3.5 7.0 11 -- - - - - - - - - - - 0.00001 Typ (2) - 4.2 - 0.88 - 2.25 - 8.8 0.002 0.004 0.006 25_C 0.88 2.25 8.8 2.75 5.50 8.25 2.25 4.50 6.75 5.0 5.0 10 15 0 0 0 1.0 2.0 4.0 7.5 1.5 3.0 4.0 - - - - - - - - - - - - - 0.1 0.05 0.05 0.05 Max - 1.7 - 0.36 - 0.9 - 2.4 4.95 9.95 14.95 0.36 0.9 2.4 Min 3.5 7.0 11 - - - - - - - - - - - 125_C 1.0 0.05 0.05 0.05 Max 30 60 120 1.5 3.0 4.0 - - - - - - - - - - - - - - mAdc mAdc mAdc mAdc mAdc Unit Vdc Vdc Vdc Vdc pF
II I I IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIII I I I IIIIIIIIII IIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIII I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I I IIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIII I III I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I II I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I I II IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I II II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I I IIII I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIII IIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIII I IIII I I I I II I IIIIIIIIII IIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I III III I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I II I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I I IIIIII IIII IIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIII IIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIII
5. The formulas given are for the typical characteristics only at 25_C. 6. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. 7. Data must be valid for 250 ns with a 5 V supply, 100 ns with 10 V, and 70 ns with 15 V.
SWITCHING CHARACTERISTICS (5) (CL = 50 pF, TA = 25_C)
Removal Times Set
Set and Reset Pulse Width
Clock Pulse Rise and Fall Time
Clock Pulse Frequency
Clock Pulse Width
Hold Times (7)
Setup Times (7)
Propagation Delay Time Clock to Q, Q tPLH, tPHL = (1.7 ns/pF) CL + 90 ns tPLH, tPHL = (0.66 ns/pF) CL + 42 ns tPLH, tPHL = (0.5 ns/pF) CL + 25 ns
Output Rise and Fall Time tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
Reset to Q, Q tPLH, tPHL = (1.7 ns/pF) CL + 265 ns tPLH, tPHL = (0.66 ns/pF) CL + 67 ns tPLH, tPHL = (0.5 ns/pF) CL + 50 ns
Set to Q, Q tPLH, tPHL = (1.7 ns/pF) CL + 90 ns tPLH, tPHL = (0.66 ns/pF) CL + 42 ns tPLH, tPHL = (0.5 ns/pF) CL + 25 ns
Reset
Characteristic
R
C
D
S
C
C
C
C
LOGIC DIAGRAM (1/2 of Device Shown)
C
C
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tWL, tWH tWL, tWH Symbol
MC14013B
tTLH, tTHL
tPLH tPHL
tTLH tTHL
trem
tsu
fcl
th
C
C
4 VDD 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5 10 15 5 10 15 C C Min 250 100 70 250 100 70 50 30 25 80 45 35 40 20 15 40 20 15 - - - - - - - - - - - - - - - - - - - 35 - 10 -5 125 50 35 125 50 35 225 100 75 175 75 50 175 75 50 100 50 40 4.0 10 14 20 10 7.5 20 10 7.5 0 5 5 - - - Typ (6) Q Q Max 450 200 150 350 150 100 350 150 100 200 100 80 15 5.0 4.0 2.0 5.0 7.0 - - - - - - - - - - - - - - - - - - MHz Unit ns ns ns ns ns ns ns ms
MC14013B
20 ns D tsu (H) C tWH 1 fcl 90% 50% 10% tTLH tTHL 90% 50% 10% 20 ns VDD 20 ns tsu (L) th VSS 20 ns VDD VSS CLOCK tPHL tPLH tPHL Q OR Q 50% SET OR RESET 90% tw 50% 20 ns 20 ns 10% trem 90% 50% tw 20 ns 10% VDD VSS VDD VSS VOH VOL
90% 50% 10% tWL
tPLH Q
VOH VOL
Inputs R and S low.
Figure 1. Dynamic Signal Waveforms (Data, Clock, and Output)
Figure 2. Dynamic Signal Waveforms (Set, Reset, Clock, and Output)
TYPICAL APPLICATIONS
n-STAGE SHIFT REGISTER
1 D D C CLOCK Q Q D C 2 Q Q D C nth Q Q Q
BINARY RIPPLE UP-COUNTER (Divide-by-2n)
1 D CLOCK C Q Q D C 2 Q Q D C nth Q Q Q
T FLIP-FLOP
MODIFIED RING COUNTER (Divide-by-(n+1))
1 D C CLOCK Q Q D C 2 Q Q D C nth Q Q Q
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5
MC14013B
PACKAGE DIMENSIONS
PDIP-14 CASE 646-06 ISSUE P
14
8
B
1 7
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 --- 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 --- 10 _ 0.38 1.01
A F N -T-
SEATING PLANE
L C
H
G
D 14 PL
K
M
J M
DIM A B C D F G H J K L M N
0.13 (0.005)
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MC14013B
PACKAGE DIMENSIONS
SOIC-14 CASE 751A-03 ISSUE H
-A-
14 8
-B-
P 7 PL 0.25 (0.010)
M
B
M
1
7
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
G C -T-
SEATING PLANE
R X 45 _
F
D 14 PL 0.25 (0.010)
K
M
M
S
J
TB
A
S
DIM A B C D F G J K M P R
MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50
INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019
SOLDERING FOOTPRINT*
7X
7.04 1 0.58
14X
14X
1.52
1.27 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MC14013B
PACKAGE DIMENSIONS
TSSOP-14 CASE 948G-01 ISSUE B
14X K REF
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V N
S
2X
L/2
14
8
0.25 (0.010) M
L
PIN 1 IDENT. 1 7
B -U-
N F DETAIL E K K1 J J1
0.15 (0.006) T U
S
A -V-
SECTION N-N -W-
C 0.10 (0.004) -T- SEATING
PLANE
D
G
H
DETAIL E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C --- 1.20 --- 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_
SOLDERING FOOTPRINT*
7.06 1
0.36
14X
14X
1.26
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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8
EEE CCC EEE CCC
0.65 PITCH
DIMENSIONS: MILLIMETERS
MC14013B
PACKAGE DIMENSIONS
SOEIAJ-14 CASE 965-01 ISSUE A
14
8
LE Q1 E HE M_ L DETAIL P
1
7
Z D e A VIEW P
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 1.42 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.056
c
b 0.13 (0.005)
M
A1 0.10 (0.004)
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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9
MC14013B/D


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